Electronics Solder Assembly Materials market

Electronics Solder Assembly Materials Market, Global Outlook and Forecast 2023-2030

  • 20 January 2023
  • Chemicals and Materials
  • 125 Pages
  • Report code : PMR-7540007

  • 4.7 (158)

Electronics Solder Assembly Materials Market

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Soldering is a joining process used to join different types of metals together by melting solder. Solder is a metal alloy usually made of tin and lead which is melted using a hot iron. The iron is heated to temperatures above 600 degrees fahrenheit which then cools to create a strong electrical bond.

Electronics Solder Assembly Materials Market contains market size and forecasts of Electronics Solder Assembly Materials in global, including the following market information:

Global Electronics Solder Assembly Materials Market Revenue, 2018-2023, 2023-2030, ($ millions)

Global Electronics Solder Assembly Materials Market Sales, 2018-2023, 2023-2030, (Tons)

Global top five Electronics Solder Assembly Materials companies in 2022 (%)

The global Electronics Solder Assembly Materials market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.

The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.

Solder Wire Segment to Reach $ Million by 2030, with a % CAGR in next six years.

The global key manufacturers of Electronics Solder Assembly Materials include Element Solutions, Lucas Milhaupt, Henkel, Senju, Koki Company Limited, Indium Corporation, MacDermid Alpha Electronics Solutions, Tamura and Inventec, etc. In 2022, the global top five players have a share approximately % in terms of revenue.

We surveyed the Electronics Solder Assembly Materials manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Electronics Solder Assembly Materials Market, by Type, 2018-2023, 2023-2030 ($ Millions) & (Tons)

Global Electronics Solder Assembly Materials Market Segment Percentages, by Type, 2022 (%)

Solder Wire

Solder Bar

Solder Paste

Solder Flux

Others

Global Electronics Solder Assembly Materials Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Tons)

Global Electronics Solder Assembly Materials Market Segment Percentages, by Application, 2022 (%)

Consumer Electronics

Automotive

Industrial

Building

Others

Global Electronics Solder Assembly Materials Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Tons)

Global Electronics Solder Assembly Materials Market Segment Percentages, By Region and Country, 2022 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Electronics Solder Assembly Materials revenues in global market, 2018-2023 (Estimated), ($ millions)

Key companies Electronics Solder Assembly Materials revenues share in global market, 2022 (%)

Key companies Electronics Solder Assembly Materials sales in global market, 2018-2023 (Estimated), (Tons)

Key companies Electronics Solder Assembly Materials sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

Element Solutions

Lucas Milhaupt

Henkel

Senju

Koki Company Limited

Indium Corporation

MacDermid Alpha Electronics Solutions

Tamura

Inventec

Stannol

Qualitek

Fusion

Heraeus

Nihon Superior

Balver Zinn

AIM Metals & Alloys

Belmont Metals

GENMA

Accurus Scientific

DUKSAN Hi-Metal

Shenzhen Vital New Material

SHENMAO Technology

Tongfang New Material Technology

Xiamen Jissyu Solder

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