Epoxy Molding Compounds for Lead Frame Market

EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.

Epoxy Molding Compounds for Lead Frame Market contains market size and forecasts of Epoxy Molding Compounds for Lead Frame in global, including the following market information:

Global Epoxy Molding Compounds for Lead Frame Market Revenue, 2018-2023, 2023-2030, ($ millions)

Global Epoxy Molding Compounds for Lead Frame Market Sales, 2018-2023, 2023-2030, (Tons)

Global top five Epoxy Molding Compounds for Lead Frame companies in 2022 (%)

The global Epoxy Molding Compounds for Lead Frame market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.

The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.

DIP Segment to Reach $ Million by 2030, with a % CAGR in next six years.

The global key manufacturers of Epoxy Molding Compounds for Lead Frame include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI and Eternal Materials, etc. In 2022, the global top five players have a share approximately % in terms of revenue.

We surveyed the Epoxy Molding Compounds for Lead Frame manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Epoxy Molding Compounds for Lead Frame Market, by Package Form, 2018-2023, 2023-2030 ($ Millions) & (Tons)

Global Epoxy Molding Compounds for Lead Frame Market Segment Percentages, by Package Form, 2022 (%)

DIP

SOP

TSOP

QFP

TQFP

LQFP

Other

Global Epoxy Molding Compounds for Lead Frame Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Tons)

Global Epoxy Molding Compounds for Lead Frame Market Segment Percentages, by Application, 2022 (%)

Integrated Circuit

Discrete Device

Others

Global Epoxy Molding Compounds for Lead Frame Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Tons)

Global Epoxy Molding Compounds for Lead Frame Market Segment Percentages, By Region and Country, 2022 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Epoxy Molding Compounds for Lead Frame revenues in global market, 2018-2023 (Estimated), ($ millions)

Key companies Epoxy Molding Compounds for Lead Frame revenues share in global market, 2022 (%)

Key companies Epoxy Molding Compounds for Lead Frame sales in global market, 2018-2023 (Estimated), (Tons)

Key companies Epoxy Molding Compounds for Lead Frame sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

Sumitomo Bakelite

Hitachi Chemical

Chang Chun Group

Hysol Huawei Electronics

Panasonic

Kyocera

KCC

Samsung SDI

Eternal Materials

Jiangsu Zhongpeng New Material

Shin-Etsu Chemical

Hexion

Nepes

Tianjin Kaihua Insulating Material

HHCK

Scienchem

Beijing Sino-tech Electronic Material