Metal Shell for Microelectronic Packages Market

Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.

Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.

Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ? has good heat conduction and heat dissipation; ? good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ? Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.

Metal Shell for Microelectronic Packages Market contains market size and forecasts of Metal Shell for Microelectronic Packages in global, including the following market information:

Global Metal Shell for Microelectronic Packages Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Metal Shell for Microelectronic Packages Market Sales, 2017-2022, 2023-2028, (K Units)

Global top five Metal Shell for Microelectronic Packages companies in 2021 (%)

The global Metal Shell for Microelectronic Packages market was valued at 2051.9 million in 2021 and is projected to reach US$ 2038.2 million by 2028, at a CAGR of -0.1% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

TO Shell Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Metal Shell for Microelectronic Packages include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, KaiRui and Jiangsu Dongguang Micro-electronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Metal Shell for Microelectronic Packages manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Metal Shell for Microelectronic Packages Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Metal Shell for Microelectronic Packages Market Segment Percentages, by Type, 2021 (%)

TO Shell

Flat Shell

Global Metal Shell for Microelectronic Packages Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Metal Shell for Microelectronic Packages Market Segment Percentages, by Application, 2021 (%)

Aeronautics and Astronautics

Petrochemical Industry

Automobile

Optical Communication

Other

Global Metal Shell for Microelectronic Packages Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Metal Shell for Microelectronic Packages Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Metal Shell for Microelectronic Packages revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Metal Shell for Microelectronic Packages revenues share in global market, 2021 (%)

Key companies Metal Shell for Microelectronic Packages sales in global market, 2017-2022 (Estimated), (K Units)

Key companies Metal Shell for Microelectronic Packages sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

AMETEK(GSP)

SCHOTT

Complete Hermetics

KOTO

Kyocera

SGA Technologies

Century Seals

KaiRui

Jiangsu Dongguang Micro-electronics

Taizhou Hangyu Electric Appliance

CETC40

BOJING ELECTRONICS

CETC43

SINOPIONEER

CCTC

XingChuang

Rizhao Xuri Electronics Co., Ltd.

ShengDa Technology