Semiconductor Package Market

Semiconductor packaging is conducted to guarantee protection to the wafer or substrate. The packaging is built from materials such as plastic, metal, glass or ceramic and is composed of one or more semiconductor electronic components.

Semiconductor packaging materials are base players of discrete semiconductor devices and integrated circuits on which other layers are deposited to complete the circuit. Thinner core materials are ideally used to surro system applications.

The validation of lead substrates has increased in comparison to lead frames and bonding wires as the industry advances more towards leadless and cable-less packages.

The market will experience robust growth due to increased demand for smart mobile devices and electronic goods.

Semiconductor Package Market contains market size and forecasts of Semiconductor Package in Global, including the following market information:

Global Semiconductor Package Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global top five companies in 2021 (%)

The global Semiconductor Package market was valued at 29490 million in 2021 and is projected to reach US$ 42990 million by 2028, at a CAGR of 5.5% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Flip Chip Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Semiconductor Package include SPIL, ASE, Amkor, JCET, TFME, Siliconware Precision Industries, Powertech Technology Inc, TSMC and Nepes, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Semiconductor Package companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Semiconductor Package Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Semiconductor Package Market Segment Percentages, by Type, 2021 (%)

• Flip Chip
• Embedded Die
• Fan-in Wafer Level Packaging (Fi Wlp)
• Fan-out Wafer Level Packaging
• Others

Global Semiconductor Package Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Semiconductor Package Market Segment Percentages, by Application, 2021 (%)

• Consumer Electronics
• Automotive Industry
• Aerospace and Defense
• Medical Devices
• Communications and Telecom
• Others

Global Semiconductor Package Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Semiconductor Package Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Semiconductor Package revenues in global market, 2017-2022 (estimated), ($ millions)
• Key companies Semiconductor Package revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• SPIL
• ASE
• Amkor
• JCET
• TFME
• Siliconware Precision Industries
• Powertech Technology Inc
• TSMC
• Nepes
• Walton Advanced Engineering
• Unisem
• Huatian
• Chipbond
• UTAC
• Chipmos
• China Wafer Level CSP
• Lingsen Precision
• Tianshui Huatian Technology Co., Ltd
• King Yuan Electronics CO., Ltd.
• Formosa
• Carsem
• J-Devices
• Stats Chippac
• Advanced Micro Devices