Through Glass Vias Technology market

Through Glass Vias Technology Market, Global Outlook and Forecast 2022-2028

  • 19 May 2022
  • ICT & Media
  • 62 Pages
  • Report code : PMR-7085007

  • 4.7 (158)

Through Glass Vias Technology Market

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A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS).
Through Glass Vias Technology Market contains market size and forecasts of Through Glass Vias Technology in Global, including the following market information:
Global Through Glass Vias Technology Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Through Glass Vias Technology market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
300 mm Wafer Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Through Glass Vias Technology include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia. etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Through Glass Vias Technology companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Through Glass Vias Technology Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Through Glass Vias Technology Market Segment Percentages, by Type, 2021 (%)
300 mm Wafer
200 mm Wafer
Below 150 mm Wafer
Global Through Glass Vias Technology Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Through Glass Vias Technology Market Segment Percentages, by Application, 2021 (%)
Biotechnology/Medical
Consumer Electronics
Automotive
Others
Global Through Glass Vias Technology Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Through Glass Vias Technology Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Through Glass Vias Technology revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Through Glass Vias Technology revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

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