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Download Free sampleDie bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
Die Bonder Equipment Market contains market size and forecasts of Die Bonder Equipment in global, including the following market information:
Global Die Bonder Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Die Bonder Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Die Bonder Equipment companies in 2021 (%)
The global Die Bonder Equipment market was valued at 813.8 million in 2021 and is projected to reach US$ 960.3 million by 2028, at a CAGR of 2.4% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fully Automatic Die Bonder Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Die Bonder Equipment include Besi, ASM Pacific Technology(ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic and FASFORD TECHNOLOGY, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Die Bonder Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Die Bonder Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die Bonder Equipment Market Segment Percentages, by Type, 2021 (%)
Fully Automatic Die Bonder
Semi-Automatic Die Bonder
Manual Die Bonder
Global Die Bonder Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die Bonder Equipment Market Segment Percentages, by Application, 2021 (%)
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Global Die Bonder Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Die Bonder Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Die Bonder Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Die Bonder Equipment revenues share in global market, 2021 (%)
Key companies Die Bonder Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies Die Bonder Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Besi
ASM Pacific Technology(ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond
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