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Download Free sampleThe semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
IC Advanced Packaging Equipment Market contains market size and forecasts of IC Advanced Packaging Equipment in global, including the following market information:
Global IC Advanced Packaging Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global IC Advanced Packaging Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five IC Advanced Packaging Equipment companies in 2021 (%)
The global IC Advanced Packaging Equipment market was valued at 6848 million in 2021 and is projected to reach US$ 12210 million by 2028, at a CAGR of 8.6% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Cutting Equipment Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of IC Advanced Packaging Equipment include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, Tokyo Seimitsu, BESI, Hitachi and Teradyne, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the IC Advanced Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global IC Advanced Packaging Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global IC Advanced Packaging Equipment Market Segment Percentages, by Type, 2021 (%)
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
Global IC Advanced Packaging Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global IC Advanced Packaging Equipment Market Segment Percentages, by Application, 2021 (%)
Automotive Electronics
Consumer Electronics
Other
Global IC Advanced Packaging Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global IC Advanced Packaging Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies IC Advanced Packaging Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies IC Advanced Packaging Equipment revenues share in global market, 2021 (%)
Key companies IC Advanced Packaging Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies IC Advanced Packaging Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
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