Test and Burn-in Sockets Market

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips.

An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below).

Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

Test and Burn-in Sockets Market contains market size and forecasts of Test and Burn-in Sockets in global, including the following market information:

• Global Test and Burn-in Sockets Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Test and Burn-in Sockets Market Sales, 2017-2022, 2023-2028, (K Units)
• Global top five Test and Burn-in Sockets companies in 2021 (%)

The global Test and Burn-in Sockets market was valued at 1388 million in 2021 and is projected to reach US$ 2077.8 million by 2028, at a CAGR of 5.9% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Burn-in Socket Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Test and Burn-in Sockets include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech and Yokowo, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Test and Burn-in Sockets manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Test and Burn-in Sockets Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Test and Burn-in Sockets Market Segment Percentages, by Type, 2021 (%)

• Burn-in Socket
• Test Socket

Global Test and Burn-in Sockets Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Test and Burn-in Sockets Market Segment Percentages, by Application, 2021 (%)

• Memory
• CMOS Image Sensor
• High Voltage
• RF
• SOC, CPU, GPU, etc.
• Other non-memory

Global Test and Burn-in Sockets Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Test and Burn-in Sockets Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa
• Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Test and Burn-in Sockets revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Test and Burn-in Sockets revenues share in global market, 2021 (%)
• Key companies Test and Burn-in Sockets sales in global market, 2017-2022 (Estimated), (K Units)
• Key companies Test and Burn-in Sockets sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Yamaichi Electronics
• Cohu
• Enplas
• ISC
• Smiths Interconnect
• LEENO
• Sensata Technologies
• Johnstech
• Yokowo
• WinWay Technology
• Loranger
• Plastronics
• OKins Electronics
• Ironwood Electronics
• 3M
• M Specialties
• Aries Electronics
• Emulation Technology
• Qualmax
• Micronics
• Essai
• Rika Denshi
• Robson Technologies
• Translarity
• Test Tooling
• Exatron
• Gold Technologies
• JF Technology
• Advanced
• Ardent Concepts