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Download Free sampleThe global Wafer-level Packaging Equipment market was valued at 2577.88 Million USD in 2021 and will grow with a CAGR of 8.76% from 2021 to 2027, based on Research newly published report.
The prime objective of Wafer-level Packaging Equipment Market is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, Wafer-level Packaging Equipment Market covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world`s largest wafer-level packaging equipment producer.
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