IC Advanced Packaging Equipment Market

The global IC Advanced Packaging Equipment market was valued at US$ 6848 million in 2022 and is projected to reach US$ 12210 million by 2029, at a CAGR of 8.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.

In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.

IC Advanced Packaging Equipment Market aims to provide a comprehensive presentation of the global market for IC Advanced Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Advanced Packaging Equipment. IC Advanced Packaging Equipment Market contains market size and forecasts of IC Advanced Packaging Equipment in global, including the following market information:

• Global IC Advanced Packaging Equipment Market Revenue, 2018-2023, 2024-2029, ($ millions)
• Global IC Advanced Packaging Equipment Market Sales, 2018-2023, 2024-2029, (Units)
• Global top five IC Advanced Packaging Equipment companies in 2022 (%)

Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.

China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.

In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.

We surveyed the IC Advanced Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

• Cutting Equipment
• Solid Crystal Devices
• Welding Equipment
• Testing Equipment
• Other

• Automotive Electronics
• Consumer Electronics
• Other

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

• Key companies IC Advanced Packaging Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
• Key companies IC Advanced Packaging Equipment revenues share in global market, 2022 (%)
• Key companies IC Advanced Packaging Equipment sales in global market, 2018-2023 (Estimated), (Units)
• Key companies IC Advanced Packaging Equipment sales share in global market, 2022 (%)

Key players include:

• ASM Pacific
• Applied Material
• Advantest
• Kulicke&Soffa
• DISCO
• Tokyo Seimitsu
• BESI
• Hitachi
• Teradyne
• Hanmi
• Toray Engineering
• Shinkawa
• COHU Semiconductor
• TOWA
• SUSS Microtec
• Outline of Major Chapters:
• Chapter 1: Introduces the definition of IC Advanced Packaging Equipment, market overview.
• Chapter 2: Global IC Advanced Packaging Equipment market size in revenue and volume.
• Chapter 3: Detailed analysis of IC Advanced Packaging Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
• Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
• Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
• Chapter 6: Sales of IC Advanced Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
• Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
• Chapter 8: Global IC Advanced Packaging Equipment capacity by region & country.
• Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
• Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
• Chapter 11: The main points and conclusions of the report.