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Download Free sampleThere are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips.
An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below).
Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.
Test and Burn-in Sockets Market aims to provide a comprehensive presentation of the global market for Test and Burn-in Sockets, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Test and Burn-in Sockets. Test and Burn-in Sockets Market contains market size and forecasts of Test and Burn-in Sockets in global, including the following market information:
Global Test and Burn-in Sockets Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Test and Burn-in Sockets Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Test and Burn-in Sockets companies in 2022 (%)
The global Test and Burn-in Sockets market was valued at US$ 1388 million in 2022 and is projected to reach US$ 2077.8 million by 2029, at a CAGR of 5.9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The main producers in the industry are Yamaichi Electronics, Cohu and Enplas, which accounted for 12%, 10% and 9% of revenues respectively. By region, consumption in the Asia-Pacific region is the highest, at more than 67 percent.
We surveyed the Test and Burn-in Sockets manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Test and Burn-in Sockets Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Test and Burn-in Sockets Market Segment Percentages, by Type, 2022 (%)
Burn-in Socket
Test Socket
Global Test and Burn-in Sockets Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Test and Burn-in Sockets Market Segment Percentages, by Application, 2022 (%)
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other non-memory
Global Test and Burn-in Sockets Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Test and Burn-in Sockets Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Test and Burn-in Sockets revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Test and Burn-in Sockets revenues share in global market, 2022 (%)
Key companies Test and Burn-in Sockets sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Test and Burn-in Sockets sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
Micronics
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts
Outline of Major Chapters:
Chapter 1: Introduces the definition of Test and Burn-in Sockets, market overview.
Chapter 2: Global Test and Burn-in Sockets market size in revenue and volume.
Chapter 3: Detailed analysis of Test and Burn-in Sockets manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Test and Burn-in Sockets in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Test and Burn-in Sockets capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
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