Advanced Packaging Market

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

Advanced Packaging Market contains market size and forecasts of Advanced Packaging in global, including the following market information:

• Global Advanced Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Advanced Packaging Market Sales, 2017-2022, 2023-2028, (K MT)
• Global top five Advanced Packaging companies in 2021 (%)

The global Advanced Packaging market was valued at 15310 million in 2021 and is projected to reach US$ 23360 million by 2028, at a CAGR of 6.2% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

3.0 DIC Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Advanced Packaging include ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC and Chipmos, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Advanced Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Advanced Packaging Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K MT)

Global Advanced Packaging Market Segment Percentages, by Type, 2021 (%)

• 3.0 DIC
• FO SIP
• FO WLP
• 3D WLP
• WLCSP
• 2.5D
• Filp Chip

Global Advanced Packaging Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K MT)

Global Advanced Packaging Market Segment Percentages, by Application, 2021 (%)

• Analog & Mixed Signal
• Wireless Connectivity
• Optoelectronic
• MEMS & Sensor
• Misc Logic and Memory
• Other

Global Advanced Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K MT)

Global Advanced Packaging Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa
• Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Advanced Packaging revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Advanced Packaging revenues share in global market, 2021 (%)
• Key companies Advanced Packaging sales in global market, 2017-2022 (Estimated), (K MT)
• Key companies Advanced Packaging sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• ASE
• Amkor
• SPIL
• Stats Chippac
• PTI
• JCET
• J-Devices
• UTAC
• Chipmos
• Chipbond
• STS
• Huatian
• NFM
• Carsem
• Walton
• Unisem
• OSE
• AOI
• Formosa
• NEPES