Advanced Semiconductor Packaging Market

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.

Advanced Semiconductor Packaging Market contains market size and forecasts of Advanced Semiconductor Packaging in global, including the following market information:

Global Advanced Semiconductor Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Advanced Semiconductor Packaging Market Sales, 2017-2022, 2023-2028, (M Units)

Global top five Advanced Semiconductor Packaging companies in 2021 (%)

The global Advanced Semiconductor Packaging market was valued at 16120 million in 2021 and is projected to reach US$ 26190 million by 2028, at a CAGR of 7.2% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Fan-Out Wafer-Level Packaging (FO WLP) Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Advanced Semiconductor Packaging include Amkor, SPIL, Intel Corp, JCET, ASE, TFME, TSMC, Huatian and Powertech Technology Inc, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Advanced Semiconductor Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Advanced Semiconductor Packaging Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (M Units)

Global Advanced Semiconductor Packaging Market Segment Percentages, by Type, 2021 (%)

Fan-Out Wafer-Level Packaging (FO WLP)

Fan-In Wafer-Level Packaging (FI WLP)

Flip Chip (FC)

2.5D/3D

Others

Global Advanced Semiconductor Packaging Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (M Units)

Global Advanced Semiconductor Packaging Market Segment Percentages, by Application, 2021 (%)

Telecommunications

Automotive

Aerospace and Defense

Medical Devices

Consumer Electronics

Global Advanced Semiconductor Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (M Units)

Global Advanced Semiconductor Packaging Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Advanced Semiconductor Packaging revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Advanced Semiconductor Packaging revenues share in global market, 2021 (%)

Key companies Advanced Semiconductor Packaging sales in global market, 2017-2022 (Estimated), (M Units)

Key companies Advanced Semiconductor Packaging sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Amkor

SPIL

Intel Corp

JCET

ASE

TFME

TSMC

Huatian

Powertech Technology Inc

UTAC

Nepes

Walton Advanced Engineering

Kyocera

Chipbond

Chipmos