Chip On Flex Market

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.

Chip On Flex Market contains market size and forecasts of Chip On Flex (COF) in global, including the following market information:

Global Chip On Flex (COF) Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Chip On Flex (COF) Market Sales, 2017-2022, 2023-2028, (K Pcs)

Global top five Chip On Flex (COF) companies in 2021 (%)

The global Chip On Flex (COF) market was valued at 1843.4 million in 2021 and is projected to reach US$ 2476.2 million by 2028, at a CAGR of 4.3% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Single Sided COF Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Chip On Flex (COF) include LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company and Compunetics and etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Chip On Flex (COF) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Chip On Flex (COF) Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Pcs)

Global Chip On Flex (COF) Market Segment Percentages, by Type, 2021 (%)

Single Sided COF

Others

Global Chip On Flex (COF) Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Pcs)

Global Chip On Flex (COF) Market Segment Percentages, by Application, 2021 (%)

Military

Medical

Aerospace

Electronics

Others

Global Chip On Flex (COF) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Pcs)

Global Chip On Flex (COF) Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Chip On Flex (COF) revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Chip On Flex (COF) revenues share in global market, 2021 (%)

Key companies Chip On Flex (COF) sales in global market, 2017-2022 (Estimated), (K Pcs)

Key companies Chip On Flex (COF) sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

LGIT

Stemco

Flexceed

Chipbond Technology

CWE

Danbond Technology

AKM Industrial

Compass Technology Company

Compunetics

STARS Microelectronics