Chip On Flex Market

The global Chip On Flex (COF) market was valued at 146.91 Million USD in 2021 and will grow with a CAGR of 4.55% from 2021 to 2027, based on Research newly published report.

The prime objective of Chip On Flex Market is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, Chip On Flex Market covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn`t have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths. COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver. Driven by a growing range of applications in the automotive, industrial, military, aerospace, computer, telecommunication, consumer electronics, and medical electronics industries, miniaturization and the use of flex circuits continue to be of prime interest to electronics manufacturers. In China, COF manufactures mainly include Danbond Technology, AKM Industrial, Compass Technology Company and others. China is the world`s third producer of COF and the world`s biggest consumption market.

By Market Verdors:

• LGIT
• Stemco
• Flexceed
• Chipbond Technology
• CWE
• Danbond Technology
• AKM Industrial
• Compass Technology Company
• Compunetics
• STARS Microelectronics

By Types:

• Single sided COF

By Applications:

• Military
• Medical
• Aerospace
• Electronics

Key Indicators Analysed

• Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market?s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
• Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
• Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
• Opportunities and Drivers: Identifying the Growing Demands and New Technology
• Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Reasons to Purchase

• To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
• Assess the production processes, major issues, and solutions to mitigate the development risk.
• To understand the most affecting driving and restraining forces in the market and its impact in the global market.
• Learn about the market strategies that are being adopted by leading respective organizations.
• To understand the future outlook and prospects for the market.
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