Chip Packaging Market

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
Chip Packaging Market contains market size and forecasts of Chip Packaging in Global, including the following market information:
Global Chip Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Chip Packaging market was valued at 32050 million in 2021 and is projected to reach US$ 48900 million by 2028, at a CAGR of 6.2% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Traditional Packaging Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Chip Packaging include ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Chip Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Chip Packaging Market Segment Percentages, by Type, 2021 (%)
Traditional Packaging
Advanced Packaging
Global Chip Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Chip Packaging Market Segment Percentages, by Application, 2021 (%)
Automotive and Traffic
Consumer Electronics
Communication
Other
Global Chip Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Chip Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip Packaging revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Chip Packaging revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS