Chip Packaging Market

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on

The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.

Chip Packaging Market contains market size and forecasts of Chip Packaging in Global, including the following market information:

Global Chip Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global top five companies in 2021 (%)

The global Chip Packaging market was valued at 32050 million in 2021 and is projected to reach US$ 48900 million by 2028, at a CAGR of 6.2% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Traditional Packaging Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Chip Packaging include ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Chip Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Chip Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Chip Packaging Market Segment Percentages, by Type, 2021 (%)

Traditional Packaging

Advanced Packaging

Global Chip Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Chip Packaging Market Segment Percentages, by Application, 2021 (%)

Automotive and Traffic

Consumer Electronics

Communication

Other

Global Chip Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Chip Packaging Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Chip Packaging revenues in global market, 2017-2022 (estimated), ($ millions)

Key companies Chip Packaging revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

ASE Group

Amkor Technology

JCET

Siliconware Precision Industries

Powertech Technology

TongFu Microelectronics

Tianshui Huatian Technology

UTAC

Chipbond Technology

Hana Micron

OSE

Walton Advanced Engineering

NEPES

Unisem

ChipMOS

Signetics

Carsem

King Yuan ELECTRONICS