3D IC and 2.5D IC Market

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

3D IC and 2.5D IC Market contains market size and forecasts of 3D IC and 2.5D IC in Global, including the following market information:

• Global 3D IC and 2.5D IC Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global top five companies in 2021 (%)

The global 3D IC and 2.5D IC market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

3D Wafer-level Chip-scale Packaging Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of 3D IC and 2.5D IC include TSMC(Taiwan), Samsung(South Korea), Toshiba(Japan), ASE Group(Taiwan), Amkor(U.S.), UMC(Taiwan), Stmicroelectronics(Switzerland), Broadcom(U.S.) and Intel(U.S.) and etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the 3D IC and 2.5D IC companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global 3D IC and 2.5D IC Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global 3D IC and 2.5D IC Market Segment Percentages, by Type, 2021 (%)

• 3D Wafer-level Chip-scale Packaging
• 3D TSV
• 2.5D

Global 3D IC and 2.5D IC Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global 3D IC and 2.5D IC Market Segment Percentages, by Application, 2021 (%)

• Consumer Electronics
• Telecommunication
• Industry Sector
• Automotive
• Military and Aerospace
• Smart Technologies
• Medical Devices

Global 3D IC and 2.5D IC Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global 3D IC and 2.5D IC Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies 3D IC and 2.5D IC revenues in global market, 2017-2022 (estimated), ($ millions)
• Key companies 3D IC and 2.5D IC revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• TSMC(Taiwan)
• Samsung(South Korea)
• Toshiba(Japan)
• ASE Group(Taiwan)
• Amkor(U.S.)
• UMC(Taiwan)
• Stmicroelectronics(Switzerland)
• Broadcom(U.S.)
• Intel(U.S.)
• Jiangsu Changjiang Electronics(China)