3D IC 2.5D IC Packaging Market

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

3D IC 2.5D IC Packaging Market contains market size and forecasts of 3D IC & 2.5D IC Packaging in global, including the following market information:

• Global 3D IC & 2.5D IC Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global 3D IC & 2.5D IC Packaging Market Sales, 2017-2022, 2023-2028, (K Units)
• Global top five 3D IC & 2.5D IC Packaging companies in 2021 (%)

The global 3D IC & 2.5D IC Packaging market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

3D TSV Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of 3D IC & 2.5D IC Packaging include Intel Corporation, Toshiba Corp, Samsung Electronics, Stmicroelectronics, Taiwan Semiconductor Manufacturing, Amkor Technology, United Microelectronics, Broadcom and ASE Group, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the 3D IC & 2.5D IC Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global 3D IC & 2.5D IC Packaging Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global 3D IC & 2.5D IC Packaging Market Segment Percentages, by Type, 2021 (%)

• 3D TSV
• 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Global 3D IC & 2.5D IC Packaging Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global 3D IC & 2.5D IC Packaging Market Segment Percentages, by Application, 2021 (%)

• Automotive
• Consumer electronics
• Medical devices
• Military & aerospace
• Telecommunication
• Industrial sector and smart technologies

Global 3D IC & 2.5D IC Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global 3D IC & 2.5D IC Packaging Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies 3D IC & 2.5D IC Packaging revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies 3D IC & 2.5D IC Packaging revenues share in global market, 2021 (%)
• Key companies 3D IC & 2.5D IC Packaging sales in global market, 2017-2022 (Estimated), (K Units)
• Key companies 3D IC & 2.5D IC Packaging sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Intel Corporation
• Toshiba Corp
• Samsung Electronics
• Stmicroelectronics
• Taiwan Semiconductor Manufacturing
• Amkor Technology
• United Microelectronics
• Broadcom
• ASE Group
• Pure Storage
• Advanced Semiconductor Engineering