Electronic Potting and Encapsulating Market

Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.

Electronic Potting and Encapsulating Market contains market size and forecasts of Electronic Potting and Encapsulating in Global, including the following market information:

Global Electronic Potting and Encapsulating Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global top five companies in 2021 (%)

The global Electronic Potting and Encapsulating market was valued at 1855.8 million in 2021 and is projected to reach US$ 3331.6 million by 2028, at a CAGR of 8.7% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Epoxy Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Electronic Potting and Encapsulating include Henkel, Dow Corning, Hitachi Chemical, LORD Corporation, Huntsman Corporation, ITW Engineered Polymers, 3M, H.B. Fuller and John C. Dolph, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Electronic Potting and Encapsulating companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Electronic Potting and Encapsulating Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Electronic Potting and Encapsulating Market Segment Percentages, by Type, 2021 (%)

Epoxy

Silicones

Polyurethane

Ohers

Global Electronic Potting and Encapsulating Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Electronic Potting and Encapsulating Market Segment Percentages, by Application, 2021 (%)

Consumer Electronics

Automotive

Medical

Telecommunications

Others

Global Electronic Potting and Encapsulating Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Electronic Potting and Encapsulating Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Electronic Potting and Encapsulating revenues in global market, 2017-2022 (estimated), ($ millions)

Key companies Electronic Potting and Encapsulating revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Henkel

Dow Corning

Hitachi Chemical

LORD Corporation

Huntsman Corporation

ITW Engineered Polymers

3M

H.B. Fuller

John C. Dolph

Master Bond

ACC Silicones

Epic Resins

Plasma Ruggedized Solutions