Electronic Underfill Material Market

Electronic Underfill Material Market contains market size and forecasts of Electronic Underfill Material in global, including the following market information:

• Global Electronic Underfill Material Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Electronic Underfill Material Market Sales, 2017-2022, 2023-2028, (K MT)
• Global top five Electronic Underfill Material companies in 2021 (%)

The global Electronic Underfill Material market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Capillary Underfill Material (CUF) Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Electronic Underfill Material include Henkel, Namics, Nordson Corporation, H.B. Fuller, Epoxy Technology Inc., Yincae Advanced Material, LLC, Master Bond Inc., Zymet Inc. and AIM Metals & Alloys LP and etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Electronic Underfill Material manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Electronic Underfill Material Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K MT)

Global Electronic Underfill Material Market Segment Percentages, by Type, 2021 (%)

• Capillary Underfill Material (CUF)
• No Flow Underfill Material (NUF)
• Molded Underfill Material (MUF)

Global Electronic Underfill Material Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K MT)

Global Electronic Underfill Material Market Segment Percentages, by Application, 2021 (%)

• Flip Chips
• Ball Grid Array (BGA)
• Chip Scale Packaging (CSP)

Global Electronic Underfill Material Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K MT)

Global Electronic Underfill Material Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Electronic Underfill Material revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Electronic Underfill Material revenues share in global market, 2021 (%)
• Key companies Electronic Underfill Material sales in global market, 2017-2022 (Estimated), (K MT)
• Key companies Electronic Underfill Material sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Henkel
• Namics
• Nordson Corporation
• H.B. Fuller
• Epoxy Technology Inc.
• Yincae Advanced Material, LLC
• Master Bond Inc.
• Zymet Inc.
• AIM Metals & Alloys LP
• Won Chemicals Co. Ltd