Fan-Out Wafer Level Packaging Market

The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.

Fan-Out Wafer Level Packaging Market contains market size and forecasts of Fan-Out Wafer Level Packaging in Global, including the following market information:

Global Fan-Out Wafer Level Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global top five companies in 2021 (%)

The global Fan-Out Wafer Level Packaging market was valued at 1409.5 million in 2021 and is projected to reach US$ 4829.4 million by 2028, at a CAGR of 19.2% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

High Density Fan-Out Package Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Fan-Out Wafer Level Packaging include TSMC, ASE Technology Holding Co., JCET Group, Amkor Technology, Siliconware Technology (SuZhou) Co. and Nepes, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Fan-Out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Fan-Out Wafer Level Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Type, 2021 (%)

High Density Fan-Out Package

Core Fan-Out Package

Global Fan-Out Wafer Level Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Fan-Out Wafer Level Packaging Market Segment Percentages, by Application, 2021 (%)

CMOS Image Sensor

A Wireless Connection

Logic and Memory Integrated Circuits

Mems and Sensors

Analog and Hybrid Integrated Circuits

Others

Global Fan-Out Wafer Level Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Fan-Out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Fan-Out Wafer Level Packaging revenues in global market, 2017-2022 (estimated), ($ millions)

Key companies Fan-Out Wafer Level Packaging revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

TSMC

ASE Technology Holding Co.

JCET Group

Amkor Technology

Siliconware Technology (SuZhou) Co.

Nepes