Flip Chip Ball Grid Array Market

FC-BGA substrates are high-density semiconductor packaging substrates that enable high speed and multi-functionality of LSI chips. The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board, and protects expensive semiconductors from external stress. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.
Flip Chip Ball Grid Array Market contains market size and forecasts of Flip Chip Ball Grid Array (FCBGA) in global, including the following market information:
Global Flip Chip Ball Grid Array (FCBGA) Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Flip Chip Ball Grid Array (FCBGA) Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Flip Chip Ball Grid Array (FCBGA) companies in 2021 (%)
The global Flip Chip Ball Grid Array (FCBGA) market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Below 8 Layer Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Flip Chip Ball Grid Array (FCBGA) include Unimicron, Ibiden, Samsung Electro-Mechanics, Amkor Technology, Fujitsu, TOPPAN INC, Shinko Electric, Nan Ya PCB Corporation and AT?S, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Flip Chip Ball Grid Array (FCBGA) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Flip Chip Ball Grid Array (FCBGA) Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Flip Chip Ball Grid Array (FCBGA) Market Segment Percentages, by Type, 2021 (%)
Below 8 Layer
8-20 Layer
Others
Global Flip Chip Ball Grid Array (FCBGA) Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Flip Chip Ball Grid Array (FCBGA) Market Segment Percentages, by Application, 2021 (%)
CPU
ASIC
GPU
Others
Global Flip Chip Ball Grid Array (FCBGA) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Flip Chip Ball Grid Array (FCBGA) Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Flip Chip Ball Grid Array (FCBGA) revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Flip Chip Ball Grid Array (FCBGA) revenues share in global market, 2021 (%)
Key companies Flip Chip Ball Grid Array (FCBGA) sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Flip Chip Ball Grid Array (FCBGA) sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
AT?S
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China