Flip Chip Ball Grid Array Market

The global Flip Chip Ball Grid Array (FCBGA) market was valued at US$ 4495.5 million in 2022 and is projected to reach US$ 6478.6 million by 2029, at a CAGR of 5.4% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.
Flip Chip Ball Grid Array Market aims to provide a comprehensive presentation of the global market for Flip Chip Ball Grid Array (FCBGA), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Ball Grid Array (FCBGA). Flip Chip Ball Grid Array Market contains market size and forecasts of Flip Chip Ball Grid Array (FCBGA) in global, including the following market information:

• Global Flip Chip Ball Grid Array (FCBGA) Market Revenue, 2018-2023, 2024-2030, ($ millions)
• Global Flip Chip Ball Grid Array (FCBGA) Market Sales, 2018-2023, 2024-2030, (K Units)
• Global top five Flip Chip Ball Grid Array (FCBGA) companies in 2022 (%)

Global key players of FC BGA (ABF (Ajinomoto Build-up Film) Substrate) include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, etc. The top five players hold a share over 68%. Asia-Pacific is the largest market, has a share about 77%, followed by North America and Europe, with share 13% and 7%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, occupied for a share of 75%, and in terms of application, PCs has a share about 57 percent.
We has surveyed the Flip Chip Ball Grid Array (FCBGA) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Flip Chip Ball Grid Array (FCBGA) Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Flip Chip Ball Grid Array (FCBGA) Market Segment Percentages, by Type, 2022 (%)
Below 8 Layer
8-20 Layer
Others
Global Flip Chip Ball Grid Array (FCBGA) Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Flip Chip Ball Grid Array (FCBGA) Market Segment Percentages, by Application, 2022 (%)
CPU
ASIC
GPU
Others
Global Flip Chip Ball Grid Array (FCBGA) Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Flip Chip Ball Grid Array (FCBGA) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Flip Chip Ball Grid Array (FCBGA) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Flip Chip Ball Grid Array (FCBGA) revenues share in global market, 2022 (%)
Key companies Flip Chip Ball Grid Array (FCBGA) sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Flip Chip Ball Grid Array (FCBGA) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Unimicron
Ibiden
Samsung Electro-Mechanics
Amkor Technology
Fujitsu
TOPPAN INC
Shinko Electric
Nan Ya PCB Corporation
AT?S
Daeduck Electronics
Kinsus Interconnect Technology
Zdtco
KYOCERA
NCAP China
Outline of Major Chapters:
Chapter 1: Introduces the definition of Flip Chip Ball Grid Array (FCBGA), market overview.
Chapter 2: Global Flip Chip Ball Grid Array (FCBGA) market size in revenue and volume.
Chapter 3: Detailed analysis of Flip Chip Ball Grid Array (FCBGA) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Flip Chip Ball Grid Array (FCBGA) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Flip Chip Ball Grid Array (FCBGA) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.