Laser Grooving Equipment for Semiconductor Market

Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.
Laser Grooving Equipment for Semiconductor Market contains market size and forecasts of Laser Grooving Equipment for Semiconductor in global, including the following market information:
Global Laser Grooving Equipment for Semiconductor Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Laser Grooving Equipment for Semiconductor Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Laser Grooving Equipment for Semiconductor companies in 2021 (%)
The global Laser Grooving Equipment for Semiconductor market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
For Millimeter Grade Wafer Thickness Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Laser Grooving Equipment for Semiconductor include ASML, DISCO, Suzhou Maxwell Technologies, HSET, EO Technics, Delphi Laser, Shenzhen Teyan Semiconductor Equipment, Synova and ASMPT and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Laser Grooving Equipment for Semiconductor manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Laser Grooving Equipment for Semiconductor Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Laser Grooving Equipment for Semiconductor Market Segment Percentages, by Type, 2021 (%)
For Millimeter Grade Wafer Thickness
For Mircon Grade Wafer Thickness
Global Laser Grooving Equipment for Semiconductor Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Laser Grooving Equipment for Semiconductor Market Segment Percentages, by Application, 2021 (%)
Semiconductor Wafer
Solar Cells
Global Laser Grooving Equipment for Semiconductor Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Laser Grooving Equipment for Semiconductor Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Laser Grooving Equipment for Semiconductor revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Laser Grooving Equipment for Semiconductor revenues share in global market, 2021 (%)
Key companies Laser Grooving Equipment for Semiconductor sales in global market, 2017-2022 (Estimated), (Units)
Key companies Laser Grooving Equipment for Semiconductor sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASML
DISCO
Suzhou Maxwell Technologies
HSET
EO Technics
Delphi Laser
Shenzhen Teyan Semiconductor Equipment
Synova
ASMPT
LasFocus