Package package Market

Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.

Package package Market contains market size and forecasts of Package on package (PoP) in global, including the following market information:

Global Package on package (PoP) Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Package on package (PoP) Market Sales, 2017-2022, 2023-2028, (K Units)

Global top five Package on package (PoP) companies in 2021 (%)

The global Package on package (PoP) market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Traditional POP Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Package on package (PoP) include Eesemi, Surface Mount Technology Association, PCBCart, Amkor Technology, Micron Technoloty, Semicon, Finetech and Circuitnet, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Package on package (PoP) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Package on package (PoP) Market, by Technology, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Package on package (PoP) Market Segment Percentages, by Technology, 2021 (%)

Traditional POP

PSfcCSP

Through-Mold-Via

Exposed-die TMV

Global Package on package (PoP) Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Package on package (PoP) Market Segment Percentages, by Application, 2021 (%)

Mobile Phones

Digital Cameras

Others

Global Package on package (PoP) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Package on package (PoP) Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Package on package (PoP) revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Package on package (PoP) revenues share in global market, 2021 (%)

Key companies Package on package (PoP) sales in global market, 2017-2022 (Estimated), (K Units)

Key companies Package on package (PoP) sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Eesemi

Surface Mount Technology Association

PCBCart

Amkor Technology

Micron Technoloty

Semicon

Finetech

Circuitnet