Plating for Microelectronics Market

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.

Plating for Microelectronics Market contains market size and forecasts of Plating for Microelectronics in Global, including the following market information:

Global Plating for Microelectronics Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global top five companies in 2021 (%)

The global Plating for Microelectronics market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Gold Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Plating for Microelectronics include DOW, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical and Raschig GmbH, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Plating for Microelectronics companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Plating for Microelectronics Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Plating for Microelectronics Market Segment Percentages, by Type, 2021 (%)

Gold

Zinc

Nickel

Bronze

Tin

Copper

Others

Global Plating for Microelectronics Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Plating for Microelectronics Market Segment Percentages, by Application, 2021 (%)

MEMS

PCB

IC

Photoelectron

Others

Global Plating for Microelectronics Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Plating for Microelectronics Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Plating for Microelectronics revenues in global market, 2017-2022 (estimated), ($ millions)

Key companies Plating for Microelectronics revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

DOW

Mitsubishi Materials Corporation

Heraeus

XiLong Scientific

Atotech

Yamato Denki

Meltex

Ishihara Chemical

Raschig GmbH

Japan Pure Chemical

Coatech

MAGNETO special anodes

Vopelius Chemie AG

Moses Lake Industries

JCU International