Plating for Microelectronics Market

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
Plating for Microelectronics Market contains market size and forecasts of Plating for Microelectronics in Global, including the following market information:
Global Plating for Microelectronics Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Plating for Microelectronics market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Gold Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Plating for Microelectronics include DOW, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical and Raschig GmbH, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Plating for Microelectronics companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Plating for Microelectronics Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Plating for Microelectronics Market Segment Percentages, by Type, 2021 (%)
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Global Plating for Microelectronics Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Plating for Microelectronics Market Segment Percentages, by Application, 2021 (%)
MEMS
PCB
IC
Photoelectron
Others
Global Plating for Microelectronics Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Plating for Microelectronics Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Plating for Microelectronics revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Plating for Microelectronics revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International