Quad-Flat-No-Lead Packaging Market

The surface-mount IC packages that are assembled on a PCB are available in different types. The most popular ones among these are the QFN packages.

QFN is a leadframe based, plastic encapsulated chip scale package (CSP) that provides customers with an ideal choice for many applications where size, weight and thermal and electrical performance are important. A leadless package, QFNs electrical connections are achieved by way of lands located on the bottom side of the component to the surface of the PCB. QFN packages have proven to be successful for a number of applications such as wireless handset, power management, analog baseband and Bluetooth devices.

Quad-Flat-No-Lead Packaging Market contains market size and forecasts of Quad-Flat-No-Lead Packaging (QFN) in global, including the following market information:

Global Quad-Flat-No-Lead Packaging (QFN) Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Quad-Flat-No-Lead Packaging (QFN) Market Sales, 2017-2022, 2023-2028, (KK Pcs)

Global top five Quad-Flat-No-Lead Packaging (QFN) companies in 2021 (%)

The global Quad-Flat-No-Lead Packaging (QFN) market was valued at 2924.4 million in 2021 and is projected to reach US$ 3231.2 million by 2028, at a CAGR of 1.4% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Punched Type Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Quad-Flat-No-Lead Packaging (QFN) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor and ChipMOS, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Quad-Flat-No-Lead Packaging (QFN) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Quad-Flat-No-Lead Packaging (QFN) Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (KK Pcs)

Global Quad-Flat-No-Lead Packaging (QFN) Market Segment Percentages, by Type, 2021 (%)

• Punched Type
• Sawn Type

Global Quad-Flat-No-Lead Packaging (QFN) Market, by Package Size, 2017-2022, 2023-2028 ($ Millions) & (KK Pcs)

Global Quad-Flat-No-Lead Packaging (QFN) Market Segment Percentages, by Package Size, 2021 (%)

• Below 2x2
• 2x2 to 3x3
• Above 3x3 to 5x5
• Above 5x5 to 7x7
• Above 7x7 to 9x9
• Above 9x9 to 12x12

Global Quad-Flat-No-Lead Packaging (QFN) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (KK Pcs)

Global Quad-Flat-No-Lead Packaging (QFN) Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Quad-Flat-No-Lead Packaging (QFN) revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Quad-Flat-No-Lead Packaging (QFN) revenues share in global market, 2021 (%)
• Key companies Quad-Flat-No-Lead Packaging (QFN) sales in global market, 2017-2022 (Estimated), (KK Pcs)
• Key companies Quad-Flat-No-Lead Packaging (QFN) sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• ASE(SPIL)
• Amkor Technology
• JCET Group
• Powertech Technology Inc.
• Tongfu Microelectronics
• Tianshui Huatian Technology
• UTAC
• Orient Semiconductor
• ChipMOS
• King Yuan Electronics
• SFA Semicon