Radiation-Hardened Electronic Components Market

Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. These devices are primarily used in high altitude applications where radiation could damage functioning of electronic components.

Radiation-Hardened Electronic Components Market contains market size and forecasts of Radiation-Hardened Electronic Components in global, including the following market information:

• Global Radiation-Hardened Electronic Components Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Radiation-Hardened Electronic Components Market Sales, 2017-2022, 2023-2028, (K Units)
• Global top five Radiation-Hardened Electronic Components companies in 2021 (%)

The global Radiation-Hardened Electronic Components market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Silicon Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Radiation-Hardened Electronic Components include Honeywell International, BAE Systems, Analog Devices, Texas Instruments, Atmel, Renesas Electronics, STMicroelectronics, Microchip Technology and Xilinx, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Radiation-Hardened Electronic Components manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Radiation-Hardened Electronic Components Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Radiation-Hardened Electronic Components Market Segment Percentages, by Type, 2021 (%)

• Silicon
• Silicon Carbide
• Gallium Nitride
• Others

Global Radiation-Hardened Electronic Components Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Radiation-Hardened Electronic Components Market Segment Percentages, by Application, 2021 (%)

• Aerospace and Defense
• Medical
• Consumer Electronics
• Industrial
• Others

Global Radiation-Hardened Electronic Components Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Radiation-Hardened Electronic Components Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Radiation-Hardened Electronic Components revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Radiation-Hardened Electronic Components revenues share in global market, 2021 (%)
• Key companies Radiation-Hardened Electronic Components sales in global market, 2017-2022 (Estimated), (K Units)
• Key companies Radiation-Hardened Electronic Components sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Honeywell International
• BAE Systems
• Analog Devices
• Texas Instruments
• Atmel
• Renesas Electronics
• STMicroelectronics
• Microchip Technology
• Xilinx
• Cobham
• VPT
• Data Device Corporation (DDC)
• Intersil
• Maxwell Technologies