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Download Free sampleThe global Advanced Packaging market was valued at 1266.48 Million USD in 2021 and will grow with a CAGR of 7.83% from 2021 to 2027, based on Research newly published report.
The prime objective of Advanced Packaging Market is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, Advanced Packaging Market covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.The commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits` small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes. These advanced-packaging technologies, many of which are still in their infancy, promise greater chip connectivity and lower power consumption compared with traditional packaging configurations.
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