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Download Free sampleThe global Underfill market was valued at 38.87 Million USD in 2021 and will grow with a CAGR of 3.03% from 2021 to 2027, based on Research newly published report.
The prime objective of Underfill Market is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, Underfill Market covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
Underfill Market studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn`t change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics. In China, the high-end underfill products mainly rely on import from foreign developed countries, like US, Germany, Japan. To meet the large demand for the high-end products, Chinese manufacturers will invest much more on the R&D, which will certainly weaken the dependence of imports.
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