Semiconductor Advanced Packaging Market

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process.
Semiconductor Advanced Packaging Market contains market size and forecasts of Semiconductor Advanced Packaging in Global, including the following market information:
Global Semiconductor Advanced Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Semiconductor Advanced Packaging market was valued at 34650 million in 2021 and is projected to reach US$ 45390 million by 2028, at a CAGR of 3.9% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fan-Out Wafer-Level Packaging(FO WLP) Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Advanced Packaging include Advanced Semiconductor Engineering(ASE), Amkor Technology, Samsung, TSMC(Taiwan Semiconductor Manufacturing Company), China Wafer Level CSP, ChipMOS Technologies, FlipChip International, HANA Micron and Interconnect Systems(Molex), etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Semiconductor Advanced Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Advanced Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Semiconductor Advanced Packaging Market Segment Percentages, by Type, 2021 (%)
Fan-Out Wafer-Level Packaging(FO WLP)
Fan-In Wafer-Level Packaging(FI WLP)
Flip Chip(FC)
2.5D/3D
Global Semiconductor Advanced Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Semiconductor Advanced Packaging Market Segment Percentages, by Application, 2021 (%)
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Global Semiconductor Advanced Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Semiconductor Advanced Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Advanced Packaging revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Semiconductor Advanced Packaging revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Advanced Semiconductor Engineering(ASE)
Amkor Technology
Samsung
TSMC(Taiwan Semiconductor Manufacturing Company)
China Wafer Level CSP
ChipMOS Technologies
FlipChip International
HANA Micron
Interconnect Systems(Molex)
Jiangsu Changjiang Electronics Technology(JCET)
King Yuan Electronics
Tongfu Microelectronics
Nepes
Powertech Technology(PTI)
Signetics
Tianshui Huatian
Veeco/CNT
UTAC Group