Semiconductor Advanced Packaging Market

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process.

Semiconductor Advanced Packaging Market contains market size and forecasts of Semiconductor Advanced Packaging in Global, including the following market information:

Global Semiconductor Advanced Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global top five companies in 2021 (%)

The global Semiconductor Advanced Packaging market was valued at 34650 million in 2021 and is projected to reach US$ 45390 million by 2028, at a CAGR of 3.9% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Fan-Out Wafer-Level Packaging(FO WLP) Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Semiconductor Advanced Packaging include Advanced Semiconductor Engineering(ASE), Amkor Technology, Samsung, TSMC(Taiwan Semiconductor Manufacturing Company), China Wafer Level CSP, ChipMOS Technologies, FlipChip International, HANA Micron and Interconnect Systems(Molex), etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Semiconductor Advanced Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Semiconductor Advanced Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Semiconductor Advanced Packaging Market Segment Percentages, by Type, 2021 (%)

Fan-Out Wafer-Level Packaging(FO WLP)

Fan-In Wafer-Level Packaging(FI WLP)

Flip Chip(FC)

2.5D/3D

Global Semiconductor Advanced Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Semiconductor Advanced Packaging Market Segment Percentages, by Application, 2021 (%)

Telecommunications

Automotive

Aerospace and Defense

Medical Devices

Consumer Electronics

Other

Global Semiconductor Advanced Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Semiconductor Advanced Packaging Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Semiconductor Advanced Packaging revenues in global market, 2017-2022 (estimated), ($ millions)

Key companies Semiconductor Advanced Packaging revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Advanced Semiconductor Engineering(ASE)

Amkor Technology

Samsung

TSMC(Taiwan Semiconductor Manufacturing Company)

China Wafer Level CSP

ChipMOS Technologies

FlipChip International

HANA Micron

Interconnect Systems(Molex)

Jiangsu Changjiang Electronics Technology(JCET)

King Yuan Electronics

Tongfu Microelectronics

Nepes

Powertech Technology(PTI)

Signetics

Tianshui Huatian

Veeco/CNT

UTAC Group