Semiconductor Packaging and Assembly Equipment Market

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.

Semiconductor Packaging and Assembly Equipment Market contains market size and forecasts of Semiconductor Packaging and Assembly Equipment in global, including the following market information:

• Global Semiconductor Packaging and Assembly Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Semiconductor Packaging and Assembly Equipment Market Sales, 2017-2022, 2023-2028, (Units)
• Global top five Semiconductor Packaging and Assembly Equipment companies in 2021 (%)

The global Semiconductor Packaging and Assembly Equipment market was valued at 2835.3 million in 2021 and is projected to reach US$ 4138.2 million by 2028, at a CAGR of 5.6% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Die- Level Packaging and Assembly Equipment Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Semiconductor Packaging and Assembly Equipment include Applied Materials, ASMPT, DISCO Corporation, EV Group, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies and SEMES, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Semiconductor Packaging and Assembly Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Semiconductor Packaging and Assembly Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging and Assembly Equipment Market Segment Percentages, by Type, 2021 (%)

• Die- Level Packaging and Assembly Equipment
• Wafer-Level Packaging and Assembly Equipment

Global Semiconductor Packaging and Assembly Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging and Assembly Equipment Market Segment Percentages, by Application, 2021 (%)

• IDM(Integrated Device Manufacturers)
• OSAT(Outsourced Semiconductor Assembly and Test Companies)

Global Semiconductor Packaging and Assembly Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging and Assembly Equipment Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Semiconductor Packaging and Assembly Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Semiconductor Packaging and Assembly Equipment revenues share in global market, 2021 (%)
• Key companies Semiconductor Packaging and Assembly Equipment sales in global market, 2017-2022 (Estimated), (Units)
• Key companies Semiconductor Packaging and Assembly Equipment sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Applied Materials
• ASMPT
• DISCO Corporation
• EV Group
• Kulicke and Soffa Industries
• TEL
• Tokyo Seimitsu
• Rudolph Technologies
• SEMES
• Suss Microtec
• Veeco/CNT
• Ulvac Technologies