Semiconductor Packaging Equipment Market

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.

Semiconductor Packaging Equipment Market contains market size and forecasts of Semiconductor Packaging Equipment in global, including the following market information:

• Global Semiconductor Packaging Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Semiconductor Packaging Equipment Market Sales, 2017-2022, 2023-2028, (Units)
• Global top five Semiconductor Packaging Equipment companies in 2021 (%)

The global Semiconductor Packaging Equipment market was valued at 5988.5 million in 2021 and is projected to reach US$ 6838.4 million by 2028, at a CAGR of 1.9% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Chip Bonding Equipment Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Semiconductor Packaging Equipment include Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, Tokyo Seimitsu, ChipMos, Greatek, Hua Hong and Jiangsu Changjiang Electronics Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Semiconductor Packaging Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Semiconductor Packaging Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging Equipment Market Segment Percentages, by Type, 2021 (%)

• Chip Bonding Equipment
• Inspection and Cutting Equipment
• Packaging equipment
• Wire bonding equipment
• Electroplating equipment
• Other

Global Semiconductor Packaging Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging Equipment Market Segment Percentages, by Application, 2021 (%)

• Manufacturer of Integrated Devices
• Packaged Semiconductor Assembly

Global Semiconductor Packaging Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging Equipment Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Semiconductor Packaging Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Semiconductor Packaging Equipment revenues share in global market, 2021 (%)
• Key companies Semiconductor Packaging Equipment sales in global market, 2017-2022 (Estimated), (Units)
• Key companies Semiconductor Packaging Equipment sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Applied Materials
• ASM Pacific Technology
• Kulicke and Soffa Industries
• Tokyo Electron Limited
• Tokyo Seimitsu
• ChipMos
• Greatek
• Hua Hong
• Jiangsu Changjiang Electronics Technology
• Lingsen Precision
• Nepes
• Tianshui Huatian
• Unisem
• Veeco/CNT