Semiconductor Packaging and Test Equipment Market

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.

Semiconductor Packaging and Test Equipment Market contains market size and forecasts of Semiconductor Packaging and Test Equipment in global, including the following market information:

Global Semiconductor Packaging and Test Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Semiconductor Packaging and Test Equipment Market Sales, 2017-2022, 2023-2028, (Units)

Global top five Semiconductor Packaging and Test Equipment companies in 2021 (%)

The global Semiconductor Packaging and Test Equipment market was valued at 11930 million in 2021 and is projected to reach US$ 17630 million by 2028, at a CAGR of 5.7% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Wafer Probe Station Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Semiconductor Packaging and Test Equipment include TEL, DISCO, ASM, Tokyo Seimitsu, Besi, Semes, Cohu, Inc., Techwing and Kulicke & Soffa Industries, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Packaging and Test Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Semiconductor Packaging and Test Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging and Test Equipment Market Segment Percentages, by Type, 2021 (%)

Wafer Probe Station

Die Bonder

Dicing Machine

Test handler

Sorter

Global Semiconductor Packaging and Test Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging and Test Equipment Market Segment Percentages, by Application, 2021 (%)

Integrated Device Manufacturer (IDMs)

Outsourced Semiconductor Assembly and Test (OSAT)

Global Semiconductor Packaging and Test Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)

Global Semiconductor Packaging and Test Equipment Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Semiconductor Packaging and Test Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Semiconductor Packaging and Test Equipment revenues share in global market, 2021 (%)

Key companies Semiconductor Packaging and Test Equipment sales in global market, 2017-2022 (Estimated), (Units)

Key companies Semiconductor Packaging and Test Equipment sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

TEL

DISCO

ASM

Tokyo Seimitsu

Besi

Semes

Cohu, Inc.

Techwing

Kulicke & Soffa Industries

Fasford

Advantest

Hanmi semiconductor

Shinkawa

Shen Zhen Sidea

DIAS Automation