SiN AMB Substrate Market

Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800?m on thin ceramic substrates of just 0.25mm.

SiN AMB Substrate Market contains market size and forecasts of SiN AMB Substrate in global, including the following market information:

Global SiN AMB Substrate Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global SiN AMB Substrate Market Sales, 2017-2022, 2023-2028, (Square Meters)

Global top five SiN AMB Substrate companies in 2021 (%)

The global SiN AMB Substrate market was valued at 78 million in 2021 and is projected to reach US$ 323.5 million by 2028, at a CAGR of 22.5% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

0.32mm SiN AMB Substrates Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of SiN AMB Substrate include Rogers Corporation, Heraeus Electronics, Kyocera, Toshiba Materials, DENKA, KCC, Ferrotec, BYD and Shenzhen Xinzhou Electronic Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the SiN AMB Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global SiN AMB Substrate Market, by Substrate Thicknesses, 2017-2022, 2023-2028 ($ Millions) & (Square Meters)

Global SiN AMB Substrate Market Segment Percentages, by Substrate Thicknesses, 2021 (%)

0.32mm SiN AMB Substrates

0.25mm SiN AMB Substrates

Global SiN AMB Substrate Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Square Meters)

Global SiN AMB Substrate Market Segment Percentages, by Application, 2021 (%)

Automobile

Traction & Railway

New Energy & Power Grid

Military & Aerospace

Others

Global SiN AMB Substrate Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Square Meters)

Global SiN AMB Substrate Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies SiN AMB Substrate revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies SiN AMB Substrate revenues share in global market, 2021 (%)

Key companies SiN AMB Substrate sales in global market, 2017-2022 (Estimated), (Square Meters)

Key companies SiN AMB Substrate sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Rogers Corporation

Heraeus Electronics

Kyocera

Toshiba Materials

DENKA

KCC

Ferrotec

BYD

Shenzhen Xinzhou Electronic Technology

Zhejiang TC Ceramic Electronic

Shengda Tech

Beijing Moshi Technology

Nantong Winspower

Wuxi Tianyang Electronics