Solder Ball Packaging Material Market

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Solder Ball Packaging Material Market contains market size and forecasts of Solder Ball Packaging Material in global, including the following market information:

• Global Solder Ball Packaging Material Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Solder Ball Packaging Material Market Sales, 2017-2022, 2023-2028, (Million Units)
• Global top five Solder Ball Packaging Material companies in 2021 (%)

The global Solder Ball Packaging Material market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Lead Solder Ball Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Solder Ball Packaging Material include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Solder Ball Packaging Material manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Solder Ball Packaging Material Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Million Units)

Global Solder Ball Packaging Material Market Segment Percentages, by Type, 2021 (%)

• Lead Solder Ball
• Lead Free Solder Ball

Global Solder Ball Packaging Material Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Million Units)

Global Solder Ball Packaging Material Market Segment Percentages, by Application, 2021 (%)

• BGA
• CSP & WLCSP
• Flip-Chip & Others

Global Solder Ball Packaging Material Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Million Units)

Global Solder Ball Packaging Material Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Solder Ball Packaging Material revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Solder Ball Packaging Material revenues share in global market, 2021 (%)
• Key companies Solder Ball Packaging Material sales in global market, 2017-2022 (Estimated), (Million Units)
• Key companies Solder Ball Packaging Material sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Senju Metal
• DS HiMetal
• MKE
• YCTC
• Nippon Micrometal
• Accurus
• PMTC
• Shanghai hiking solder material
• Shenmao Technology
• Indium Corporation
• Jovy Systems