Solder Spheres Market

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Solder Spheres Market contains market size and forecasts of Solder Spheres in global, including the following market information:

Global Solder Spheres Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Solder Spheres Market Sales, 2017-2022, 2023-2028, (Million Units)

Global top five Solder Spheres companies in 2021 (%)

The global Solder Spheres market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Lead Solder Spheres Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Solder Spheres include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Solder Spheres manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Solder Spheres Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Million Units)

Global Solder Spheres Market Segment Percentages, by Type, 2021 (%)

Lead Solder Spheres

Lead Free Solder Spheres

Global Solder Spheres Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Million Units)

Global Solder Spheres Market Segment Percentages, by Application, 2021 (%)

BGA

CSP & WLCSP

Flip-Chip & Others

Global Solder Spheres Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Million Units)

Global Solder Spheres Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Solder Spheres revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Solder Spheres revenues share in global market, 2021 (%)

Key companies Solder Spheres sales in global market, 2017-2022 (Estimated), (Million Units)

Key companies Solder Spheres sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Senju Metal

DS HiMetal

MKE

YCTC

Nippon Micrometal

Accurus

PMTC

Shanghai hiking solder material

Shenmao Technology

Indium Corporation

Jovy Systems