System In a Package and 3D Packaging Market

A System in a Package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die.

SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die.

The System in a Package (SIP) and 3D Packaging industry can be broken down into several segments, non 3D Packaging, 3D Packaging, etc.

System In a Package and 3D Packaging Market contains market size and forecasts of System In a Package (SIP) and 3D Packaging in global, including the following market information:

Global System In a Package (SIP) and 3D Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global System In a Package (SIP) and 3D Packaging Market Sales, 2017-2022, 2023-2028, (M Pieces)

Global top five System In a Package (SIP) and 3D Packaging companies in 2021 (%)

The global System In a Package (SIP) and 3D Packaging market was valued at 8752.2 million in 2021 and is projected to reach US$ 24000 million by 2028, at a CAGR of 15.5% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Non 3D Packaging Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of System In a Package (SIP) and 3D Packaging include Amkor, SPIL, JCET, ASE, Powertech Technology Inc, TFME, ams AG, UTAC and Huatian, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the System In a Package (SIP) and 3D Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global System In a Package (SIP) and 3D Packaging Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (M Pieces)

Global System In a Package (SIP) and 3D Packaging Market Segment Percentages, by Type, 2021 (%)

Non 3D Packaging

3D Packaging

Global System In a Package (SIP) and 3D Packaging Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (M Pieces)

Global System In a Package (SIP) and 3D Packaging Market Segment Percentages, by Application, 2021 (%)

Telecommunications

Automotive

Medical Devices

Consumer Electronics

Other

Global System In a Package (SIP) and 3D Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (M Pieces)

Global System In a Package (SIP) and 3D Packaging Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies System In a Package (SIP) and 3D Packaging revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies System In a Package (SIP) and 3D Packaging revenues share in global market, 2021 (%)

Key companies System In a Package (SIP) and 3D Packaging sales in global market, 2017-2022 (Estimated), (M Pieces)

Key companies System In a Package (SIP) and 3D Packaging sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Amkor

SPIL

JCET

ASE

Powertech Technology Inc

TFME

ams AG

UTAC

Huatian

Nepes

Chipmos

Suzhou Jingfang Semiconductor Technology Co