Temporary Bonding Adhesive market

Temporary Bonding Adhesive Market - Global Outlook and Forecast 2022-2028

  • 03 February 2022
  • Semiconductor and Electronics
  • 75 Pages
  • Report code : PMR-6836383

  • 4.7 (158)

Temporary Bonding Adhesive Market

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Temporary bonding adhesive can bonded with different surface, This product can be used for backside processes such as fixing, thinning, etching, passivation, electroplating, and reflow soldering of thin wafers below 100?m.

Temporary Bonding Adhesive Market contains market size and forecasts of Temporary Bonding Adhesive in global, including the following market information:

  • Global Temporary Bonding Adhesive Market Revenue, 2017-2022, 2023-2028, ($ millions)
  • Global Temporary Bonding Adhesive Market Sales, 2017-2022, 2023-2028, (Kg)
  • Global top five Temporary Bonding Adhesive companies in 2021 (%)

The global Temporary Bonding Adhesive market was valued at 201.6 million in 2021 and is projected to reach US$ 342.1 million by 2028, at a CAGR of 7.8% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Thermal Slide?off Debonding Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Temporary Bonding Adhesive include 3M, Daxin Materials, Brewer Science, AI Technology, YINCAE Advanced Materials, Micro Materials, Promerus and Daetec, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Temporary Bonding Adhesive manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Temporary Bonding Adhesive Market, by Debonding Method, 2017-2022, 2023-2028 ($ Millions) & (Kg)

Global Temporary Bonding Adhesive Market Segment Percentages, by Debonding Method, 2021 (%)

  • Thermal Slide?off Debonding
  • Mechanical Debonding
  • Laser Debonding

Global Temporary Bonding Adhesive Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Kg)

Global Temporary Bonding Adhesive Market Segment Percentages, by Application, 2021 (%)

  • MEMS
  • Advanced Packaging
  • CMOS
  • Others

Global Temporary Bonding Adhesive Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Kg)

Global Temporary Bonding Adhesive Market Segment Percentages, By Region and Country, 2021 (%)

  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Russia
  • Nordic Countries
  • Benelux
  • Rest of Europe
  • Asia
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Rest of Asia
  • South America
  • Brazil
  • Argentina
  • Rest of South America
  • Middle East & Africa
  • Turkey
  • Israel
  • Saudi Arabia
  • UAE
  • Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

  • Key companies Temporary Bonding Adhesive revenues in global market, 2017-2022 (Estimated), ($ millions)
  • Key companies Temporary Bonding Adhesive revenues share in global market, 2021 (%)
  • Key companies Temporary Bonding Adhesive sales in global market, 2017-2022 (Estimated), (Kg)
  • Key companies Temporary Bonding Adhesive sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

  • 3M
  • Daxin Materials
  • Brewer Science
  • AI Technology
  • YINCAE Advanced Materials
  • Micro Materials
  • Promerus
  • Daetec

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