Test Burn-in Socket Market

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

Test Burn-in Socket Market contains market size and forecasts of Test & Burn-in Socket in global, including the following market information:

Global Test & Burn-in Socket Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Test & Burn-in Socket Market Sales, 2017-2022, 2023-2028, (K Units)

Global top five Test & Burn-in Socket companies in 2021 (%)

The global Test & Burn-in Socket market was valued at 1268.7 million in 2021 and is projected to reach US$ 2152.9 million by 2028, at a CAGR of 7.8% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Burn-in Socket Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Test & Burn-in Socket include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech and Yokowo, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Test & Burn-in Socket manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Test & Burn-in Socket Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Test & Burn-in Socket Market Segment Percentages, by Type, 2021 (%)

Burn-in Socket

Test Socket

Global Test & Burn-in Socket Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Test & Burn-in Socket Market Segment Percentages, by Application, 2021 (%)

Memory

CMOS Image Sensor

High Voltage

RF

SOC, CPU, GPU, etc.

Other Non-Memory

Global Test & Burn-in Socket Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Test & Burn-in Socket Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Test & Burn-in Socket revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Test & Burn-in Socket revenues share in global market, 2021 (%)

Key companies Test & Burn-in Socket sales in global market, 2017-2022 (Estimated), (K Units)

Key companies Test & Burn-in Socket sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

Yamaichi Electronics

Cohu

Enplas

ISC

Smiths Interconnect

LEENO

Sensata Technologies

Johnstech

Yokowo

WinWay Technology

Loranger

Plastronics

OKins Electronics

Ironwood Electronics

3M

M Specialties

Aries Electronics

Emulation Technology

Qualmax

MJC

Essai

Rika Denshi

Robson Technologies

Translarity

Test Tooling

Exatron

Gold Technologies

JF Technology

Advanced

Ardent Concepts