Thick-Film Hybrid Integrated Circuits Market

Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.

Thick-Film Hybrid Integrated Circuits Market contains market size and forecasts of Thick-Film Hybrid Integrated Circuits in global, including the following market information:

Global Thick-Film Hybrid Integrated Circuits Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Thick-Film Hybrid Integrated Circuits Market Sales, 2017-2022, 2023-2028, (K Units)

Global top five Thick-Film Hybrid Integrated Circuits companies in 2021 (%)

The global Thick-Film Hybrid Integrated Circuits market was valued at 5847.8 million in 2021 and is projected to reach US$ 8059.6 million by 2028, at a CAGR of 4.7% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Al2O3 Ceramic Substrate Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Thick-Film Hybrid Integrated Circuits include International Rectifier (Infineon), Crane Interpoint, GE Aviation, VPT (HEICO), MDI, MSK (Anaren), Technograph Microcircuits, Cermetek Microelectronics and Midas Microelectronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Thick-Film Hybrid Integrated Circuits manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Thick-Film Hybrid Integrated Circuits Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Thick-Film Hybrid Integrated Circuits Market Segment Percentages, by Type, 2021 (%)

Al2O3 Ceramic Substrate

BeO Ceramic Substrate

Ain Substrate

Others

Global Thick-Film Hybrid Integrated Circuits Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Thick-Film Hybrid Integrated Circuits Market Segment Percentages, by Application, 2021 (%)

Aviation and National Defense

Automotive Industry

Telecommunication and Computer Industry

Consumer Electronics

Others

Global Thick-Film Hybrid Integrated Circuits Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Thick-Film Hybrid Integrated Circuits Market Segment Percentages, By Region and Country, 2021 (%)

North America

US

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies Thick-Film Hybrid Integrated Circuits revenues in global market, 2017-2022 (Estimated), ($ millions)

Key companies Thick-Film Hybrid Integrated Circuits revenues share in global market, 2021 (%)

Key companies Thick-Film Hybrid Integrated Circuits sales in global market, 2017-2022 (Estimated), (K Units)

Key companies Thick-Film Hybrid Integrated Circuits sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

International Rectifier (Infineon)

Crane Interpoint

GE Aviation

VPT (HEICO)

MDI

MSK (Anaren)

Technograph Microcircuits

Cermetek Microelectronics

Midas Microelectronics

NAURA Technology Group Co., Ltd.

JRM

International Sensor Systems

Zhenhua Microelectronics Ltd.

Xin Jingchang Electronics Co.,Ltd

E-TekNet

China Electronics Technology Group Corporation

Kolektor Siegert GmbH

Advance Circtuit Technology

AUREL s.p.a.

Fenghua Advanced Technology Holding CO.,LTD,

Custom Interconnect

Integrated Technology Lab

Chongqing Sichuan Instrument Microcircuit Co., Ltd.