The global Thin Wafers Temporary Bonding Equipment and Materials market was valued at US$ million in 2022 and is projected to reach US$ million by 2035, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the Magic material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.
Thin Wafers Temporary Bonding Equipment and Materials Market aims to provide a comprehensive presentation of the global market for Thin Wafers Temporary Bonding Equipment and Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thin Wafers Temporary Bonding Equipment and Materials. Thin Wafers Temporary Bonding Equipment and Materials Market contains market size and forecasts of Thin Wafers Temporary Bonding Equipment and Materials in global, including the following market information:
Global Thin Wafers Temporary Bonding Equipment and Materials Market Revenue, 2018-2023, 2024-2035, ($ millions)
Global top five companies in 2022 (%)
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Chemical Debonding Segment to Reach $ Million by 2035, with a % CAGR in next six years.
The global key manufacturers of Thin Wafers Temporary Bonding Equipment and Materials include 3M, ABB, Accretech, AGC, AMD, Cabot, Corning, Crystal Solar and Dalsa, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Thin Wafers Temporary Bonding Equipment and Materials companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Thin Wafers Temporary Bonding Equipment and Materials Market, by Type, 2018-2023, 2024-2035 ($ millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Type, 2022 (%)
- Chemical Debonding
- Hot Sliding Debonding
- Mechanical Debonding
- Laser Debonding
Global Thin Wafers Temporary Bonding Equipment and Materials Market, by Application, 2018-2023, 2024-2035 ($ millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, by Application, 2022 (%)
- < 100 m Wafers
- below 40m Wafers
Global Thin Wafers Temporary Bonding Equipment and Materials Market, By Region and Country, 2018-2023, 2024-2035 ($ Millions)
Global Thin Wafers Temporary Bonding Equipment and Materials Market Segment Percentages, By Region and Country, 2022 (%)
- North America (United States, Canada, Mexico)
- Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
- Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
- The Middle East and Africa (Middle East, Africa)
- South and Central America (Brazil, Argentina, Rest of SCA)
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues in global market, 2018-2023 (estimated), ($ millions)
- Key companies Thin Wafers Temporary Bonding Equipment and Materials revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
- 3M
- ABB
- Accretech
- AGC
- AMD
- Cabot
- Corning
- Crystal Solar
- Dalsa
- DoubleCheck Semiconductors
- 1366 Technologies
- Ebara
- ERS
- Hamamatsu
- IBM
- Intel
- LG Innotek
- Mitsubishi Electric
- Qualcomm
- Robert Bosch
- Samsung
- Sumitomo Chemical
Outline of Major Chapters:
Chapter 1: Introduces the definition of Thin Wafers Temporary Bonding Equipment and Materials, market overview.
Chapter 2: Global Thin Wafers Temporary Bonding Equipment and Materials market size in revenue.
Chapter 3: Detailed analysis of Thin Wafers Temporary Bonding Equipment and Materials company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Thin Wafers Temporary Bonding Equipment and Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
Industry Market Size
