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Download Free sampleA through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). Through Glass Via Substrate Market studies the TGV substrate (TGV wafer).
Through Glass Via Substrate Market contains market size and forecasts of Through Glass Via (TGV) Substrate in global, including the following market information:
Global Through Glass Via (TGV) Substrate Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Through Glass Via (TGV) Substrate Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Through Glass Via (TGV) Substrate companies in 2021 (%)
The global Through Glass Via (TGV) Substrate market was valued at 51 million in 2021 and is projected to reach US$ 227.2 million by 2028, at a CAGR of 23.6% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
300 mm Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Through Glass Via (TGV) Substrate include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia. etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Through Glass Via (TGV) Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Through Glass Via (TGV) Substrate Market, by Size, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Through Glass Via (TGV) Substrate Market Segment Percentages, by Size, 2021 (%)
300 mm
200 mm
Below 150 mm
Global Through Glass Via (TGV) Substrate Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Through Glass Via (TGV) Substrate Market Segment Percentages, by Application, 2021 (%)
Biotechnology/Medical
Consumer Electronics
Automotive
Others
Global Through Glass Via (TGV) Substrate Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Through Glass Via (TGV) Substrate Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Through Glass Via (TGV) Substrate revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Through Glass Via (TGV) Substrate revenues share in global market, 2021 (%)
Key companies Through Glass Via (TGV) Substrate sales in global market, 2017-2022 (Estimated), (Units)
Key companies Through Glass Via (TGV) Substrate sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
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