Through-Silicon Vias Market

Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.

Through-Silicon Vias Market contains market size and forecasts of Through-Silicon Vias (TSVs) in Global, including the following market information:

• Global Through-Silicon Vias (TSVs) Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global top five companies in 2021 (%)

The global Through-Silicon Vias (TSVs) market was valued at 1848.1 million in 2021 and is projected to reach US$ 7357.7 million by 2028, at a CAGR of 21.8% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

2.5D Through-Silicon Vias Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Through-Silicon Vias (TSVs) include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung and Tianshui Huatian Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Through-Silicon Vias (TSVs) companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Through-Silicon Vias (TSVs) Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Through-Silicon Vias (TSVs) Market Segment Percentages, by Type, 2021 (%)

• 2.5D Through-Silicon Vias
• 3D Through-Silicon Vias

Global Through-Silicon Vias (TSVs) Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Through-Silicon Vias (TSVs) Market Segment Percentages, by Application, 2021 (%)

• Mobile And Consumer Electronics
• Communication Equipment
• Automotive And Transportation Electronics

Global Through-Silicon Vias (TSVs) Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Through-Silicon Vias (TSVs) Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Through-Silicon Vias (TSVs) revenues in global market, 2017-2022 (estimated), ($ millions)
• Key companies Through-Silicon Vias (TSVs) revenues share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• ASE Technology Holding
• Amkor Technology
• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• GLOBALFOUNDRIES
• JCET Group
• Samsung
• Tianshui Huatian Technology