Ultra-Wideband Chipset for Communication Market

Like Bluetooth and Wi-Fi, ultra-wideband (UWB) is a short-range, wireless communication protocol that operates through radio waves. But unlike its counterparts, it operates at very high frequencies ? a broad spectrum of GHz frequencies ? and can be used to capture highly accurate spatial and directional data.
This report focus on Ultra-Wideband Chipset for Communication market.
Ultra-Wideband Chipset for Communication Market contains market size and forecasts of Ultra-Wideband Chipset for Communication in global, including the following market information:
Global Ultra-Wideband Chipset for Communication Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Ultra-Wideband Chipset for Communication Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Ultra-Wideband Chipset for Communication companies in 2021 (%)
The global Ultra-Wideband Chipset for Communication market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Imaging Measurement Systems Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Ultra-Wideband Chipset for Communication include Alereon Inc., Bespoon SAS, Decawave Limited, Taiyo Yuden CO., LTD, Taoglas, Johanson Technology, Inc, NOVELDA, NXP Semiconductors N.V and Pulse-Link, Inc, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Ultra-Wideband Chipset for Communication manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Ultra-Wideband Chipset for Communication Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Ultra-Wideband Chipset for Communication Market Segment Percentages, by Type, 2021 (%)
Imaging Measurement Systems
Non-imaging Measuring Systems
Global Ultra-Wideband Chipset for Communication Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Ultra-Wideband Chipset for Communication Market Segment Percentages, by Application, 2021 (%)
Manufacturing
Retail
Automotive
Healthcare
Consumer Electronics
Others
Global Ultra-Wideband Chipset for Communication Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Ultra-Wideband Chipset for Communication Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Ultra-Wideband Chipset for Communication revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Ultra-Wideband Chipset for Communication revenues share in global market, 2021 (%)
Key companies Ultra-Wideband Chipset for Communication sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Ultra-Wideband Chipset for Communication sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Alereon Inc.
Bespoon SAS
Decawave Limited
Taiyo Yuden CO., LTD
Taoglas
Johanson Technology, Inc
NOVELDA
NXP Semiconductors N.V
Pulse-Link, Inc
Fractus Antennas S.L.
Furaxa Inc.
Sewio Networks
Zebra Technologies Corporation (MSSI)
Time Domain Corp (Humatics)
Realtek
STMicroelectronics