Underfill Market

Underfill Market studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.

Underfill Market contains market size and forecasts of Underfill in global, including the following market information:

• Global Underfill Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Underfill Market Sales, 2017-2022, 2023-2028, (MT)
• Global top five Underfill companies in 2021 (%)

The global Underfill market was valued at 455.3 million in 2021 and is projected to reach US$ 577.1 million by 2028, at a CAGR of 3.4% during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Semiconductor Underfills Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Underfill include Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline and AIM Solder, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Underfill manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Underfill Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (MT)

Global Underfill Market Segment Percentages, by Type, 2021 (%)

• Semiconductor Underfills
• Board Level Underfills

Global Underfill Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (MT)

Global Underfill Market Segment Percentages, by Application, 2021 (%)

• Industrial Electronics
• Defense & Aerospace Electronics
• Consumer Electronics
• Automotive Electronics
• Medical Electronics
• Others

Global Underfill Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (MT)

Global Underfill Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Underfill revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Underfill revenues share in global market, 2021 (%)
• Key companies Underfill sales in global market, 2017-2022 (Estimated), (MT)
• Key companies Underfill sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Henkel
• WON CHEMICAL
• NAMICS
• SUNSTAR
• Hitachi Chemical
• Fuji
• Shin-Etsu Chemical
• Bondline
• AIM Solder
• Zymet
• Panacol-Elosol
• Master Bond
• DOVER
• Darbond
• HIGHTITE
• U-bond