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Download Free sampleWafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.
Wafer Bonder Market contains market size and forecasts of Wafer Bonder in global, including the following market information:
Global Wafer Bonder Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Bonder Market Sales, 2017-2022, 2023-2028, (Unit)
Global top five Wafer Bonder companies in 2021 (%)
The global Wafer Bonder market was valued at 141.8 million in 2021 and is projected to reach US$ 233.2 million by 2028, at a CAGR of 7.4% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Semi-Automated Wafer Bonder Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Bonder include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Bonder manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Bonder Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Unit)
Global Wafer Bonder Market Segment Percentages, by Type, 2021 (%)
Semi-Automated Wafer Bonder
Automated Wafer Bonder
Global Wafer Bonder Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Unit)
Global Wafer Bonder Market Segment Percentages, by Application, 2021 (%)
MEMS
Advanced Packaging
CMOS
Others
Global Wafer Bonder Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Unit)
Global Wafer Bonder Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Bonder revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Bonder revenues share in global market, 2021 (%)
Key companies Wafer Bonder sales in global market, 2017-2022 (Estimated), (Unit)
Key companies Wafer Bonder sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE
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