Wafer Grinding Tapes Market

Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.

Wafer Grinding Tapes Market contains market size and forecasts of Wafer Grinding Tapes in global, including the following market information:

Global Wafer Grinding Tapes Market Revenue, 2017-2022, 2023-2028, ($ millions)

Global Wafer Grinding Tapes Market Sales, 2017-2022, 2023-2028, (K Sqm)

Global top five Wafer Grinding Tapes companies in 2021 (%)

The global Wafer Grinding Tapes market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

UV Type Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Wafer Grinding Tapes include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology, Force-One Applied Materials and AMC Co, Ltd and etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Wafer Grinding Tapes manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Wafer Grinding Tapes Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)

Global Wafer Grinding Tapes Market Segment Percentages, by Type, 2021 (%)

• UV Type
• Non-UV Type

Global Wafer Grinding Tapes Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)

Global Wafer Grinding Tapes Market Segment Percentages, by Application, 2021 (%)

• Standard
• Standard Thin Die
• (S)DBG(GAL)
• Bump

Global Wafer Grinding Tapes Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)

Global Wafer Grinding Tapes Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Wafer Grinding Tapes revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Wafer Grinding Tapes revenues share in global market, 2021 (%)
• Key companies Wafer Grinding Tapes sales in global market, 2017-2022 (Estimated), (K Sqm)
• Key companies Wafer Grinding Tapes sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Mitsui Chemicals Tohcello
• Nitto
• LINTEC
• Furukawa Electric
• Denka
• D&X
• AI Technology
• Force-One Applied Materials
• AMC Co, Ltd
• Pantech Tape Co., Ltd