Wafer Level Packaging Market

The global Wafer Level Packaging market was valued at 3233.82 Million USD in 2021 and will grow with a CAGR of 10.74% from 2021 to 2027, based on newly published report.

The prime objective of Wafer Level Packaging Market is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, Wafer Level Packaging Market covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. There is no single industry-standard method of wafer-level packaging at present. A major application area of WLPs are smartphones due to the size constraints.

By Market Verdors:

Amkor Technology Inc

Fujitsu Ltd

Jiangsu Changjiang Electronics

Deca Technologies

Qualcomm Inc

Toshiba Corp

Tokyo Electron Ltd

Applied Materials, Inc

ASML Holding NV

Lam Research Corp

KLA-Tencor Corration

China Wafer Level CSP Co. Ltd

Marvell Technology Group Ltd

Siliconware Precision Industries

Nanium SA

STATS Chip

PAC Ltd

By Types:

3D TSV WLP

2.5D TSV WLP

WLCSP

Nano WLP

By Applications:

Electronics

IT & Telecommunication

Industrial

Automotive

Aerospace & Defense

Healthcare

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market?s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Reasons to Purchase

To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.

Assess the production processes, major issues, and solutions to mitigate the development risk.

To understand the most affecting driving and restraining forces in the market and its impact in the global market.

Learn about the market strategies that are being adopted by leading respective organizations.

To understand the future outlook and prospects for the market.

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