3D IC 2.5D IC Packaging Market

The "India 3D IC & 2.5D IC Packaging Market" size was valued at US$ 1.78 billion in 2024 and is projected to reach US$ 4.23 billion by 2030, at a CAGR of 15.5%.

3D IC & 2.5D IC Packaging in India: These advanced semiconductor packaging technologies integrate multiple chips to enhance performance, reduce size, and improve power efficiency. 3D IC packaging stacks chips vertically with interconnects, achieving high integration density, while 2.5D IC packaging places chips side-by-side on an interposer, offering flexibility with improved thermal management. In India, these technologies are gaining traction due to growing demand for high-performance electronics, driven by industries like IoT, AI, and telecommunications.

Advanced semiconductor packaging technologies for three-dimensional and 2.5-dimensional integrated circuits.

The Indian market shows rapid growth, driven by high-performance computing needs. Data center applications lead demand, with AI processors showing fastest growth. Through-silicon via technology advancing. Thermal management improving.

3D IC 2.5D IC Packaging Market contains market size and forecasts of 3D IC & 2.5D IC Packaging in India, including the following market information:

• India 3D IC & 2.5D IC Packaging Market Revenue, 2019-2024, 2024-2030, ($ millions)
• India 3D IC & 2.5D IC Packaging Market Sales, 2019-2024, 2024-2030,
• India Top five 3D IC & 2.5D IC Packaging companies in 2023 (%)

Report Includes

3D IC 2.5D IC Packaging Market presents an overview of India market for 3D IC & 2.5D IC Packaging , sales, revenue and price. Analyses of the India market trends, with historic market revenue/sales data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.

3D IC 2.5D IC Packaging Market focuses on the 3D IC & 2.5D IC Packaging sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the India 3D IC & 2.5D IC Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues.

3D IC 2.5D IC Packaging Market will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

3D IC 2.5D IC Packaging Market analyzes the segments data by Type, and by Sales Channels, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Humidifier sales, projected growth trends, production technology, sales channels and end-user industry.

By Type

• 3D TSV
• 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

By Applications

• Automotive
• Consumer electronics
• Medical devices
• Military & aerospace
• Telecommunication
• Industrial sector and smart technologies

Key Companies

• Intel Corporation
• Samsung Electronics Co., Ltd.
• Advanced Semiconductor Engineering, Inc.
• Taiwan Semiconductor Manufacturing Company, Limited
• United Microelectronics Corporation
• Qualcomm Incorporated
• Broadcom Inc.
• Micron Technology, Inc.
• STMicroelectronics
• ASE Group

Including or excluding key companies relevant to your analysis.

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies 3D IC & 2.5D IC Packaging revenues in Indian market, 2019-2024 (Estimated), ($ millions)
• Key companies 3D IC & 2.5D IC Packaging revenues share in Indian market, 2023 (%)
• Key companies 3D IC & 2.5D IC Packaging sales in Indian market, 2019-2024 (Estimated),
• Key companies 3D IC & 2.5D IC Packaging sales share in Indian market, 2023 (%)

Key Indicators Analysed

• Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2019-2030 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
• Indian Market Analysis: The report includes Indian market status and outlook 2019-2030. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
• Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
• Opportunities and Drivers: Identifying the Growing Demands and New Technology
• Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Benefits of This Market Research:

• Industry drivers, restraints, and opportunities covered in the study
• Neutral perspective on the market performance
• Recent industry trends and developments
• Competitive landscape & strategies of key players
• Potential & niche segments and regions exhibiting promising growth covered
• Historical, current, and projected market size, in terms of value
• In-depth analysis of the 3D IC & 2.5D IC Packaging Market
• Overview of the regional outlook of the 3D IC & 2.5D IC Packaging Market

Key Reasons to Buy this Report:

• Access to date statistics compiled by our researchers. These provide you with historical and forecast data, which is analyzed to tell you why your market is set to change
• This enables you to anticipate market changes to remain ahead of your competitors
• You will be able to copy data from the Excel spreadsheet straight into your marketing plans, business presentations or other strategic documents
• The concise analysis, clear graph, and table format will enable you to pinpoint the information you require quickly
• Provision of market value (USD Billion) data for each segment and sub-segment
• Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
• Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
• Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
• Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
• The current as well as the future market outlook of the industry concerning recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
• Includes in-depth analysis of the market from various perspectives through Porter’s five forces analysis
• Provides insight into the market through Value Chain
• Market dynamics scenario, along with growth opportunities of the market in the years to come
• 6-month post-sales analyst support

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